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Metal–nitride–oxide–semiconductor transistor

In this article, we will delve into the fascinating world of Metal–nitride–oxide–semiconductor transistor, exploring its many facets and shedding light on issues that have sparked the interest and curiosity of many. From its impact on society to its implications in the scientific field, including its influence on popular culture, this exhaustive analysis will seek to unravel the mysteries surrounding Metal–nitride–oxide–semiconductor transistor and offer a panoramic view that allows our readers to better understand its importance and relevance. in a world in constant change and evolution. Join us on this journey of discovery and reflection about Metal–nitride–oxide–semiconductor transistor, whose impact is felt in all areas of modern life.

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The metal–nitride–oxide–semiconductor or metal–nitride–oxide–silicon (MNOS) transistor is a type of MOSFET (metal–oxide–semiconductor field-effect transistor) in which the oxide layer is replaced by a double layer of nitride and oxide.[1] It is an alternative and supplement to the existing standard MOS technology, wherein the insulation employed is a nitride-oxide layer.[2][3] It is used in non-volatile computer memory.[4]

History

The first silicon dioxide transistors were developed by Frosch and Derick in 1957 at Bell Labs.[5]

In late 1967, a Sperry research team led by H.A. Richard Wegener invented the metal–nitride–oxide–semiconductor (MNOS) transistor,[6] a type of MOSFET in which the oxide layer is replaced by a double layer of nitride and oxide.[1] Nitride was used as a trapping layer instead of a floating gate, but its use was limited as it was considered inferior to a floating gate.[7]

Charge trap (CT) memory was introduced with MNOS devices in the late 1960s. It had a device structure and operating principles similar to floating-gate (FG) memory, but the main difference is that the charges are stored in a conducting material (typically a doped polysilicon layer) in FG memory, whereas CT memory stored charges in localized traps within a dielectric layer (typically made of silicon nitride).[8]

See also

References

  1. ^ a b Brodie, Ivor; Muray, Julius J. (2013). The Physics of Microfabrication. Springer Science & Business Media. p. 74. ISBN 9781489921604.
  2. ^ Frohman-Bentchkowsky, D. (1970). "The metal-nitride-oxide-silicon (MNOS) transistor—Characteristics and applications". Proceedings of the IEEE. 58 (8): 1207–1219. doi:10.1109/PROC.1970.7897.
  3. ^ "Metal–nitride–oxide–semiconductor (MNOS) technology". JEDEC.
  4. ^ Ng, Kwok K. (2010). "Metal-Nitride-Oxide Semiconductor Transistor". Complete Guide to Semiconductor Devices. John Wiley & Sons, Inc. pp. 353–360. doi:10.1002/9781118014769.ch47. ISBN 9781118014769.
  5. ^ Frosch, C. J.; Derick, L (1957). "Surface Protection and Selective Masking during Diffusion in Silicon". Journal of the Electrochemical Society. 104 (9): 547. doi:10.1149/1.2428650.
  6. ^ Wegener, H. A. R.; Lincoln, A. J.; Pao, H. C.; O'Connell, M. R.; Oleksiak, R. E.; Lawrence, H. (October 1967). The variable threshold transistor, a new electrically-alterable, non-destructive read-only storage device. 1967 International Electron Devices Meeting. Vol. 13. p. 70. doi:10.1109/IEDM.1967.187833.
  7. ^ Prall, Kirk; Ramaswamy, Nirmal; Goda, Akira (2015). "Chapter 2: A Synopsis on the State of the Art of NAND Memories". Charge-Trapping Non-Volatile Memories: Volume 1 – Basic and Advanced Devices. Springer. pp. 37–64 (39). ISBN 9783319152905.
  8. ^ Ioannou-Soufleridis, V.; Dimitrakis, Panagiotis; Normand, Pascal (2015). "Chapter 3: Charge-Trap Memories with Ion Beam Modified ONO Stracks". Charge-Trapping Non-Volatile Memories: Volume 1 – Basic and Advanced Devices. Springer. pp. 65–102 (65). ISBN 9783319152905.