In this article we will delve into the fascinating world of Mini Small Outline Package, exploring its different facets and characteristics that make it so relevant in today's society. From its origin to its impact today, we will delve into its history, evolution and relevance in the contemporary context. Through a detailed analysis, we will discover how Mini Small Outline Package has influenced various aspects of daily life, as well as more specific areas such as culture, economics or politics. With a broad and diverse approach, we aim to shed light on this very relevant topic to better understand the world around us.

The Mini Small Outline Package (MSOP) is a miniaturized version of the small outline integrated circuit packaging format for integrated circuits.
Many integrated circuits are available in the MSOP form factor. They are suited for space-limited applications requiring 1 mm or less mounted height and are commonly used in disk drives, video/audio and consumer electronics.[1]
The size of the Mini Small Outline Package is only 3mm × 3mm for the 8 and 10 pin versions[1] and 3mm × 4mm for the 12 and 16 pin version.[2][3] The small package offers a small footprint, short wires for improved electrical connections, and good moisture reliability.[1] Some versions have an exposed pad on the bottom side. The exposed pad will be soldered on the PCB to transfer heat from the package to the PCB.[2][1]
| Package | Pins | Body width (mm) | Body length (mm) | Lead pitch (mm) |
|---|---|---|---|---|
| MSOP8 | 8 | 3 | 3 | 0.65 |
| MSOP10 | 10 | 3 | 3 | 0.5 |
| MSOP12 | 12 | 3 | 4 | 0.65 |
| MSOP16 | 16 | 3 | 4 | 0.5 |